Grinding plate with Diamond segments for HTC machines

This Diamond segments are Specifically designed for grinding applications on hard concrete(terrazzo)


Remove hard epoxies, urethane, and other coatings or toppings.

Soft bond, Medium Bond and Hard Bond are available for Different surface materials.

Used on CHA machine from Taiwan,Klindex from Italy, HTC machine and SPE from the UK with high performance

Diamond grit can be decided by our customers:16/20,30/40,40/50,50/60,etc.

Diamond segment