(JDRDIATOOL@163.COM)Diamond blade,polishing pad, hole saw,drill bit, grinding wheel, cutting tools

2.Where particles are too closely clustered, the leading particles do most of the ‘work’ whereas the following ones are not contributing fully to the cutting mechanism. This leads to premature pullout of the leading particles. Similarly, where large gaps between particles exist, the bond is being exposed to the workpiece which leads to erosion of the bond.The overall effect on blade performance was lower tool lives and slower cutting speeds. 3.Ideally, diamond particles should be evenly distributed throughout the bond which means they are all subject to the same cutting forces and the segment is operating at its optimum efficiency.Up till now this has only been possible to achieve by using time consuming manual labour - a situation which is clearly unacceptable in mass production manufacture. 4.This situation has now changed though with a new development called Arrayed – an automatic array system of segment Arrayed diamond blade

BCU resin-copper bond polishing pads , style DR. With high diamond concentration and copper inside, the BCE serial pads, never use Sic as additive, with aggressive and tenaciously, better heat transmissibility performance, can be used both by dry or by wet. They are designed for a variety of applications and can be used in the fabrication shop and at the jobsite. They are with the capability for a high glossy degree. Standard BCU pads see below. Other styles and sizes are available on customer's request. Use for all materials: Granite/Marble Terrazzo/Concrete/Engineered Stone/Porcelain/Quartz Maximum 4000 RPM  Grit Loop Velcro  Color Product Number               3"×2.2mm 4"×2.2mm 5"×2.2mm 6"×2.2mm 7"×2.2mm 30 OLIVE GREEN 3QR3BCU0030 4QR3BCU0030 5QR3BCU0030 6QR3BCU0030 7QR3BCU0030 50 BLUE 3QR3BCU0050 4QR3BCU0050 5QR3BCU0050 6QR3BCU0050 7QR3BCU0050 100 YELLOW 3QR3BCU0100 4QR3BCU0100 5QR3BCU0100 6QR3BCU0100 7QR3BCU01