Resin Copper Bond Polishing Pads
BCU resin-copper bond polishing pads , style DR. With high diamond concentration and copper inside, the BCE serial pads, never use Sic as additive, with aggressive and tenaciously, better heat transmissibility performance, can be used both by dry or by wet. They are designed for a variety of applications and can be used in the fabrication shop and at the jobsite. They are with the capability for a high glossy degree. Standard BCU pads see below. Other styles and sizes are available on customer's request. Use for all materials: Granite/Marble Terrazzo/Concrete/Engineered Stone/Porcelain/Quartz Maximum 4000 RPM Grit Loop Velcro Color Product Number 3"×2.2mm 4"×2.2mm 5"×2.2mm 6"×2.2mm 7"×2.2mm 30 OLIVE GREEN 3QR3BCU0030 4QR3BCU0030 5QR3BCU0030 6QR3BCU0030 7QR3BCU0030 50 BLUE 3QR3BCU0050 4QR3BCU0050 5QR3BCU0050 6QR3BCU0050 7QR3BCU0050 ...