Resin Copper Bond Polishing Pads

BCU resin-copper bond polishing pads, style DR. With high diamond concentration and copper inside, the BCE serial pads, never use Sic as additive, with aggressive and tenaciously, better heat transmissibility performance, can be used both by dry or by wet. They are designed for a variety of applications and can be used in the fabrication shop and at the jobsite. They are with the capability for a high glossy degree. Standard BCU pads see below. Other styles and sizes are available on customer's request.

Use for all materials:
Granite/Marble
Terrazzo/Concrete/Engineered Stone/Porcelain/Quartz




Diamond metal pads

Maximum 4000 RPM 


GritLoop Velcro  ColorProduct Number              
3"×2.2mm4"×2.2mm5"×2.2mm6"×2.2mm7"×2.2mm
30OLIVE GREEN3QR3BCU00304QR3BCU00305QR3BCU00306QR3BCU00307QR3BCU0030
50BLUE3QR3BCU00504QR3BCU00505QR3BCU00506QR3BCU00507QR3BCU0050
100YELLOW3QR3BCU01004QR3BCU01005QR3BCU01006QR3BCU01007QR3BCU0100
200ORANGE3QR3BCU02004QR3BCU02005QR3BCU02006QR3BCU02007QR3BCU0200
400RED3QR3BCU04004QR3BCU04005QR3BCU04006QR3BCU04007QR3BCU0400
800DARK GREEN3QR3BCU08004QR3BCU08005QR3BCU08006QR3BCU08007QR3BCU0800
1500LIGHT GREEN3QR3BCU15004QR3BCU15005QR3BCU15006QR3BCU15007QR3BCU1500
3000BROWN3QR3BCU30004QR3BCU30005QR3BCU30006QR3BCU30007QR3BCU3000


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